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Two-dimensional devices and integration towards the silicon lines

Nature Materials volume 21, pages 1225–1239 (2022)Cite this article

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Abstract

Despite technical efforts and upgrades, advances in complementary metal–oxide–semiconductor circuits have become unsustainable in the face of inherent silicon limits. New materials are being sought to compensate for silicon deficiencies, and two-dimensional materials are considered promising candidates due to their atomically thin structures and exotic physical properties. However, a potentially applicable method for incorporating two-dimensional materials into silicon platforms remains to be illustrated. Here we try to bridge two-dimensional materials and silicon technology, from integrated devices to monolithic ‘on-silicon’ (silicon as the substrate) and ‘with-silicon’ (silicon as a functional component) circuits, and discuss the corresponding requirements for material synthesis, device design and circuitry integration. Finally, we summarize the role played by two-dimensional materials in the silicon-dominated semiconductor industry and suggest the way forward, as well as the technologies that are expected to become mainstream in the near future.

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Fig. 1: Summary of applications and potential for 2D materials integrated with silicon.
Fig. 2: Photonic devices and 2D transistors integrated into CMOS lines.
Fig. 3: Monolithic on-silicon 2D circuit demonstrations.
Fig. 4: Monolithic with-silicon hybrid integration.
Fig. 5: Requirements for material transfer and device design.

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Acknowledgements

This work was supported by the National Key Research and Development Program of China (2021YFA1200500), National Natural Science Foundation of China (61925402 and 62090032) and Science and Technology Commission of Shanghai Municipality (19JC1416600).

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  1. These authors contributed equally: Shuiyuan Wang, Xiaoxian Liu, Mingsheng Xu, Liwei Liu.

Authors and Affiliations

  1. Shanghai Key Lab for Future Computing Hardware and System, School of Microelectronics, Fudan University, Shanghai, China

    Shuiyuan Wang, Xiaoxian Liu & Peng Zhou

  2. State Key Laboratory of Silicon Materials, School of Micro-Nano Electronics & Materials Science and Engineering, Zhejiang University, Hangzhou, China

    Mingsheng Xu & Deren Yang

  3. Frontier Institute of Chip and System & Qizhi Institute, Fudan University, Shanghai, China

    Liwei Liu & Peng Zhou

  4. Hubei Yangtze Memory Laboratories, Wuhan, China

    Peng Zhou

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S.W., X.L., M.X. and L.L. co-wrote the manuscript. P.Z. conceived the idea and supervised the review. D.Y. provided valuable input to the overall process. All authors provided suggestions for revisions and improvements to the review.

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Wang, S., Liu, X., Xu, M. et al. Two-dimensional devices and integration towards the silicon lines. Nat. Mater. 21, 1225–1239 (2022). https://doi.org/10.1038/s41563-022-01383-2

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