Fig. 1: Literature review for relations of yield strength and conductivity as well as thermal stability of pure CG and UFG copper prepared by different severe plastic deformation and powder sintering methods2,3,4,5,6,7,8,9,10,11,12,13,14,15,16,17,18,19,20,21,22,23,24,25,26,27. | Communications Materials

Fig. 1: Literature review for relations of yield strength and conductivity as well as thermal stability of pure CG and UFG copper prepared by different severe plastic deformation and powder sintering methods2,3,4,5,6,7,8,9,10,11,12,13,14,15,16,17,18,19,20,21,22,23,24,25,26,27.

From: Enhanced electrical conductivity and mechanical properties in thermally stable fine-grained copper wire

Fig. 1

a Yield strength versus conductivity. b Grain size versus annealing temperature. BM ball milling, HP/R hot pressing and rolling, SPS spark plasma sintering, WD wire drawing, ECAP/R/E equal-channel angular pressing, rolling and extrusion, DCT deep cryogenic treatment, ED electro-deposition, LP/D liquid pressing and drawing, HRDSR high-speed-ratio differential speed rolling, DPD dynamic plastic deformation, CR cold rolling, ARB accumulative rolling bonding, SMGT surface mechanical grinding treatment, LSEM large strain extrusion machining, HPT high-pressure torsion, IGC inert gas condensation.

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