Fig. 6: Schematic representation of microstructural evolutions of copper during swaging and annealing processes and their influences on mechanical, thermal, and conductive properties. | Communications Materials

Fig. 6: Schematic representation of microstructural evolutions of copper during swaging and annealing processes and their influences on mechanical, thermal, and conductive properties.

From: Enhanced electrical conductivity and mechanical properties in thermally stable fine-grained copper wire

Fig. 6

Electrons are mainly scattered by GBs and dislocations in the CG (figure in the right) and swaged copper (figure in the middle), respectively, while pass through the super-long oriented grain channels without scattering after annealing (figure in the upper right corner). The low-angle GBs with sub-micrometer interval block dislocation slip and enhance the strength (figure in the lower right corner).

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